Subject Areas :
امیرحسین اسلامی 1 , سید مجتبی زبرجد 2 , محمد محسن مشکسار 3
1 - مربی، دانشگاه علمی و کاربردی جهاد دانشگاهی مشهد
2 - استاد، دانشکده مهندسی، دانشگاه شیراز
3 - استاد، دانشکده مهندسی، واحد مرودشت، دانشگاه آزاد اسلامی
Keywords:
Abstract :
[1] امیرحسین اسلامی،"بررسی اثرات ذرات دی سیلیساید مولیبدن(MoSi2) بر رفتار مکانیکی و الکتریکی ماده مرکب زمینه مس تولید شده به روش اتصال نوردی تجمعی (ARB)"،نشریه مواد نوین ، دوره 4، شماره 13، ص57-68، پاییز1392.
[2] H. Eslami, S.M. Zebarjad& M.M. Moshksar, “A study on the mechanical and magnetic properties of Cu/Ni multilayer composite fabricated by Accumulative Roll Bonding process (ARB)”, Materials Science and Technology, Vol. 29, pp. 52-64, 2013.
[3] S. A. Hosseini, H. Danesh Manesh, “High-strength, high-conductivity ultra-fine grains commercial pure copper produced by ARB process”, Materials and Design, Vol 30, pp. 2911–2918, 2009.
[4] Y. Saito, N. Tsuji, H. Utsunomiya, T. Sakari & R.G. Hong, “Ultra-fine grained bulk aluminum produced accumulative roll-bonding (ARB) process”, Scripta Materialia, Vol. 39, pp.1221-1227, 1998.
[5] J. Young Hwan, K. Sang shik & H. Seung- Zeon, "Tensile Behavior of Commercially Pure Copper Sheet Fabricated by2- and 3- Layered Accumulative Roll Bonding(ARB)Process", Metal and Materials International, Vol. 14, pp. 171-179, 2008.
[6] Y. S. Kim, S. H. Kang, & D. H. Shin,” Effect of rolling direction on the microstructure and mechanical properties of accumulative roll bonding (ARB) processed commercially pure 1050 aluminum alloy”, Materials Science Forum, Vol. 503, pp. 681-686, 2006.
[7] B.A. Movchan, FD. Lemkey,” Mechanical properties of fine-crystalline two-phase materials”, Material Science and Engineering.A,Vol.45,1997.
[8] L. Cha-Yong, H. Seung-Zeon & H. L. Seong,"Formation of Nano-Sized Grains in Cu and Cu-Fe-P Alloys by Accumulative Roll Bonding Process",Metals and Materials International, Vol.12, pp.225-232, 2006.
[9] H. Sekine, R Chen, “A combined microstructure strengthening analysis of SiCp/Al metal matrix composites”, Composites, Vol. 26, pp.183-188, 1995.
[10] C. Lu, K. Tieu & D. Wexler, “Significant enhancement of bond strength in the accumulative roll bonding”, Composites, Vol. 26, pp. 145-156, 2008.
[11] C. P. Heason, P. B. Prangnell, “Texture Evolution and Grain Refinement in Al Deformed to Ultra-High Strains by Accumulative Roll Bonding (ARB)”, Material Science Forum, Vol. 733, pp. 408-418, 2002.
[12] N. Hansen, X. Huang, R. Ueji & N. Tsuji, “Structure and strength after large strain deformation”, Mater Sci Eng A, Vol, 191, pp. 387–389, 2004.
[13] J. Abenojar, F. Velasco & M. A. Martinez, “Optimization of processing parameters for the Al %10 B4C system obtained by mechanical alloying”, Journal of Materials Processing, Vol. 328, pp.222-229, 2008.
[14] L. Ghalandari, M. M. Moshksar, "High Strength and High Conductive Cu/Ag Multilayer Produced by ARB", Journal of Alloys and Compounds, Vol. 506, pp. 172-178, 2010.