Enhancement Performance New Generation of CPU Cooling System Using Water-AL2O3 Nanofluid

محورهای موضوعی : فصلنامه شبیه سازی و تحلیل تکنولوژی های نوین در مهندسی مکانیک

M. Aliabadi ¹ (MSc Student, Department of mechanical engineering, Khomeinishahr Branch, Islamic Azad University, Isfahan, Iran)
A.R. Shateri ² (Assistant Prof., Department of mechanical engineering, University of Shahrekord, Shahrekord, Iranx)

تاریخ دریافت : 1394/10/29 تاریخ پذیرش : 1394/10/29 تاریخ انتشار : 1392/12/01

کلید واژه: heat transfer, Fan, Al2O3, Liquid Cooling System, CPU, Radiator,

چکیده مقاله :

By increase in the power of computer systems and enhanced power of the components and their temperature, including the central processing unit (CPU), cooling just by the air is not effective and there is need for more powerful systems to cool down and increase the power of the cooling system. In this article simulation of the heat exchanger material of the fluid cooling system has been studied using the ANSYS-Fluent software. In this kind of heat exchanger, the water based aluminum oxide nanofluid is used instead of water to increase the total heat transfer coefficient and causing decrease in the output temperature and enhancement of fluid cooling system performance. The results with different speeds of 1000 rpm, 1500 rpm and 2000 rpm and for various volume fractions (1-3%) have been obtained. by increase in the rotational speed from 1000 rpm to 2000 rpm the flowing capacity has increased from 0.0138 kg/s to 0.026 kg/s. for the speed of 1000 rpm, the amount of heat transfer has increased about 13% for the 3% volume fraction. By increase in the volume fraction of aluminum oxide nanofluid, the total heat transfer coefficient increases too, and this increase in the coefficient is approximately similar for different speeds and it causes decrease in the output temperature of the radiator fluid

منابع و مأخذ:

[1]    Miller.D and Kang.S, Closed Loop Liquid Cooling for High Performance Computer Systems,ASME 2007 InterPACK Conference, Vancouver, British Columbia, Canada, 2007, pp. 509-515.

[2]    Yu.C.W and Webb R.L, Thermal design of a desktop computer system using CFD analysis, Semiconductor ThermalMeasurement and Management. Seventeenth Annual IEEE Symposium, 2001, pp. 18-26.

[3]    Jae-Young.C, Hee Sung.P, Jong In.J and Julia S,A System Design of Liquid Cooling Computer Based on the Micro Cooling Technology, Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on, 2006, pp. 157-160.

[4]    Lee.T.Y,Andrews.P and Saums.D, Compact liquid cooling system for small, moveable electronic equipment,  Semiconductor Thermal Measurement and Management Symposium, 1992. SEMI-THERM VIII., Eighth Annual IEEE, 1992, pp. 30-36.

[5]    Tuckerman.D.B and Pease.R.F.W.,High-performance heat sinking for VLSI, Electron Device Letters, IEEE, Vol.2, 1981, pp.126-129,.

[6]    Xie.L, Liu.Z.J, He.Y.L and Tao.W.Q, Numerical study of laminar heat transfer and pressure drop characteristics in a water-cooled minichannel heat sink, Applied Thermal Engineering, Vol. 29, 2009, pp. 64-74.

[7]    Jasperson.B.A, Yongho.J, Turner.K.T, Pfefferkorn.F.E and Weilin.Q, Comparison of Micro-Pin-Fin and Microchannel Heat Sinks Considering Thermal-Hydraulic Performance and Manufacturability, Components and Packaging Technologies, IEEE Transactions on, Vol.33, 2010, pp. 148-160.

[8]    Salem.T.E, Porschet.D and Bayne.S.B, Thermal performance of water-cooled heat sinks: a comparison of two different designs, Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE, 2005, pp. 264-269.

[9]    Nazari.M, Karami.M and Ashouri.M, Comparing the thermal performance of water, Ethylene Glycol, Alumina and CNT nanofluids in CPU cooling: Experimental study, Experimental Thermal and Fluid Science, Vol.57, 2014, pp. 371-377.

[10] Rafati.M, Hamidi.A.A and Shariati Niaser.M, Application of nanofluids in computer cooling systems (heat transfer performance of nanofluids), Applied Thermal Engineering, Vol.45–46, 2012, pp. 9-14.

[11] M.Faraday.(1847). The Birth of Nanotechnology.Available:http://www.nanogallery.info/nanogallery/?ipg=126.

[12] Bucak.S, Importance of Defining when Applying, J Chem Eng Process Technol, Vol.2, 2011,pp. 43-50.

[13] D. R. Lide. CRC Handbook of Chemistry and Physics Internet Version 2005 (85ed.).CRC Press.Available: http://www.hbcpnetbase.com.

[14] Sridhara.V and Satapathy.L, Al2O3-based nanofluids: a review, Nanoscale Research Letters, Vol.6, 2011, pp. 1-16.

[15] FLUENT 6.3 User’s Guide.

[16] Xuan.Y and Roetzel.W, Conceptions for heat transfer correlation of nanofluids,International Journal of Heat and Mass Transfer, Vol.43,2000, pp. 3701-3707.

[17] Kang.H.U, Kim.S.H and Oh.J, Estimation of Thermal Conductivity of Nanofluid Using Experimental Effective Particle Volume," Experimental Heat Transfer, Vol.19,2006, pp. 181-191.